Transitional Layer for Electronic Modules and Producing Method Thereof

ABSTRACT

An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e. the release layer (40), is provided with an operation hole (42), a chip (21) and a fingerprint identification element (23) provided on various electronic modules (20) can communicate with the outside, and the user can directly carry out an operation of inputting the program code by means of the electronic module preparation layer (A), thereby effectively improving the defect in the prior art that various electronic modules (20) can easily be bent and damaged when directly inputting into the electronic modules (20), and an electronic module preparation layer (A) is thus provided.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a transitional layer for electronicmodules, and more particularly to a transitional layer that provides aconvenient way to process the electronic modules and prevents theelectronic modules from being damaged.

2. Description of Related Art

Conventional integrated circuit cards have become indispensable in life.Through the technique of radio-frequency identification (RFID), a usermay utilize an integrated circuit card to transmit a signal with anon-contact inductive operation. In a conventional producing process ofthe integrated circuit cards, a programmed code is embedded into eachone of the electronic modules of the integrated circuit cards one byone. Afterward, each one of the electronic modules will be mounted witha printed layer, and become a finished product of the integrated circuitcard.

However, the electronic module is easy to be bended in the conventionalproducing process, and electronic components in the electronic modulethereon may be damaged. As a result, the conventional producing processof the integrated circuit cards has a shortcoming of high cost, whichshould be improved.

SUMMARY OF THE INVENTION

To prevent the electronic modules from being bended to damage in theconventional producing process of the integrated circuit cards, thepresent invention provides a transitional layer for the electronicmodules. Covering multiple electronic modules in a substrate with tworelease papers, the transitional layer may protect the multipleelectronic modules from being damaged. Moreover, the transitional layermay be directly used for loading the multiple electronic modules withprogrammed codes. Thus the shortcoming of the prior art may be overcomeeffectively.

The present invention provides a transitional layer for electronicmodules, and the transitional layer has a substrate, multiple electronicmodules, and two release papers. The substrate has multiple containingholes disposed therethrough at spaced intervals. The multiple electronicmodules are mounted to the substrate, and each one of the multipleelectronic modules is located in a respective one of the multiplecontaining holes and has at least one input element. The two releasepapers are respectively mounted to the substrate and the multipleelectronic modules via an adhesive coat, and at least one of the tworelease papers has operation holes disposed therethrough and aligningwith the input elements of the multiple electronic modules.

Besides, in the aforementioned transitional layer for electronicmodules, each one of the multiple electronic modules has multiple inputelements, which comprise a chip, a button, and a fingerprintidentification element, and the multiple input elements are disposed ona same surface of the electronic module.

Furthermore, in the aforementioned transitional layer for electronicmodules, the multiple electronic modules are identically oriented andmounted to the substrate. One of the two release papers has saidmultiple operation holes disposed therethrough. The multiple operationholes respectively align with the input elements.

Moreover, in the aforementioned transitional layer for electronicmodules, the substrate has multiple positioning parts disposed at spacedintervals. Each one of the two release papers has multiple release paperpositioning parts aligning with the multiple positioning parts of thesubstrate.

The present invention also provides a producing method of a transitionallayer for electronic modules, and the producing method comprises asubstrate preparing step, an electronic modules mounting step, and asecond release paper mounting step. The substrate preparing stepcomprises preparing a substrate having multiple containing holesdisposed therethrough, and preparing a first release paper coated withviscose to paste on the substrate. The electronic modules mounting stepcomprises preparing multiple electronic modules, wherein each one of themultiple electronic modules has at least one input element, and puttingeach one of the multiple electronic modules in a respective one of themultiple containing holes. The second release paper mounting stepcomprises preparing a second release paper with multiple operationholes, coating the substrate and the multiple electronic modules withviscose, and pasting the second release paper on the substrate, whereineach one of the multiple operation holes communicates with a respectiveone of the input elements of the multiple electronic modules.

Besides, in the aforementioned producing method of a transitional layerfor electronic modules, in the substrate preparing step, the substratehas multiple positioning parts disposed at spaced intervals. The firstrelease paper has multiple first release paper positioning parts, and ispasted on the substrate by overlapping the multiple first release paperpositioning parts and the multiple positioning parts of the substrate.

Besides, in the aforementioned producing method of a transitional layerfor electronic modules, in the second release paper mounting step, thesubstrate has multiple positioning parts disposed at spaced intervals.The second release paper has multiple second release paper positioningparts, and is pasted on the substrate by overlapping the multiple secondrelease paper positioning parts and the multiple positioning parts ofthe substrate.

Moreover, in the aforementioned producing method of a transitional layerfor electronic modules, each one of the multiple electronic modulescomprises multiple said input elements. The multiple input elementscomprise a chip, a button, and a fingerprint identification element. Thesecond release paper has multiple operation holes disposed therethrough.In the second release paper mounting step, the second release paper ispasted on the substrate with each one of the multiple operation holescommunicating with a respective one of the chips or a respective one ofthe fingerprint identification elements of the multiple electronicmodules.

Furthermore, in the aforementioned producing method of a transitionallayer for electronic modules, after the second release paper mountingstep, the producing method further comprises a rolling and standingstep. The rolling and standing step comprises squeezing the two releasepapers for exhausting air between the substrate, the multiple electronicmodules, and the two release papers, closely abutting the substrate andthe two release papers, and packaging the multiple electronic modules.

The present invention further provides a producing method of integratedcircuit cards comprising the aforementioned producing method of atransitional layer for electronic modules, a programmed code embeddingstep, and a printed layers pasting and cutting step. The printed layerspasting and cutting step comprises removing the two release papers,pasting two printed layers, and cutting the two printed layers, thesubstrate, and the multiple electronic modules into multiple integratedcircuit cards.

By means of the aforementioned technical features, a user may directlyuse the transitional layer for electronic modules to embed programmedcodes into the multiple electronic modules via the exposed chips and theexposed fingerprint identification elements, through the multipleoperation holes of the second release paper. Throughout the process, theadhesive coats and the release papers provide the multiple electronicmodules with effects of packaging and protecting. Therefore, themultiple electronic modules may be prevented from bending and therebybeing damaged by the transitional layer for electronic modules, incomparison with the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial exploded perspective view of a transitional layerfor electronic modules in accordance with the present invention;

FIG. 2 is an enlarged perspective view of an electronic module of thetransitional layer for electronic modules in FIG. 1;

FIG. 3 is an exploded perspective view of the transitional layer forelectronic modules in FIG. 1;

FIG. 4 is a side view in partial section of the transitional layer forelectronic modules in FIG. 1;

FIG. 5 is an operational view of the transitional layer for electronicmodules in FIG. 1;

FIG. 6 is a perspective view of a finished product of the transitionallayer for electronic modules in FIG. 1;

FIG. 7 is a flow diagram of a producing method of a transitional layerfor electronic modules in accordance with the present invention; and

FIG. 8 is a flow diagram of a producing method of an integrated circuitcard via the transitional layer for electronic modules in FIG. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In order to understand the technical features and practical effects ofthe present invention in detail and implement the present inventionaccording to the specification, the detailed description of a preferredembodiment shown in the drawings will be further described as follows.

With reference to FIGS. 1 to 3, a transitional layer A comprises asubstrate 10, multiple electronic modules 20, and two release papers 30,40.

The substrate 10 is a board having multiple containing holes 11 andmultiple positioning parts 12. The multiple containing holes 11 arerespectively disposed through two side surfaces of the substrate 10 atspaced intervals, and are arranged in lines along a lengthwise directionand a widthwise direction of the substrate 10. Each one of the multiplecontaining holes 11 has a shape matching with the multiple electronicmodules 20. The multiple positioning parts 12 are multiple through holesthat are separately disposed through a pair of parallel sides of thesubstrate 10.

The multiple electronic modules 20 are mounted to the substrate 10, andare located in the multiple containing holes 11, respectively. Withreference to FIG. 2, each one of the electronic modules 20 has multipleinput elements comprising a chip 21, a button 22, and a fingerprintidentification element 23. The chip 21, the button 22, and thefingerprint identification elements 23 are electrically connected. Thechip 21, the button 22, and the fingerprint identification element 23are disposed at spaced intervals on a same surface of the electronicmodule 20. Additionally, the multiple electronic modules 20 areidentically oriented while being mounted to the substrate 10.

With reference to FIGS. 1, 3, and 4, the two release papers 30, 40,which comprise a first release paper 30 and a second release paper 40,are both transparent. The two release papers 30, 40 are respectivelypasted on two surfaces of the substrate 10 along with the multipleelectronic modules 20 via an adhesive coat 103, 104. The first releasepaper 30 has multiple first release paper positioning parts 31. Thefirst release paper positioning parts 31 may be marked points or throughholes having equal inner diameters with the multiple positioning parts12 of the substrate 10. Each one of the multiple first release paperpositioning parts 31 aligns with a respective one of the multiplepositioning parts 12 of the substrate 10. As a result, the first releasepaper 30 may be neatly pasted on the substrate 10 by overlapping themultiple positioning parts 12 of the substrate 10 with the multiplefirst release paper positioning parts 31.

The second release paper 40 has multiple second release paperpositioning parts 41 and multiple operation holes 42. The second releasepaper positioning parts 41 may be marked points or through holes havingequal inner diameters with the multiple positioning parts 12 of thesubstrate 10. Each one of the multiple second release paper positioningparts 41 aligns with a respective one of the multiple positioning parts12 of the substrate 10. As a result, the second release paper 40 may beneatly pasted on the substrate 10 by overlapping the multiplepositioning parts 12 of the substrate 10 with the multiple secondrelease paper positioning parts 41. The multiple operation holes 42 aredisposed through the second release paper 40. Also, the multipleoperation holes 42 respectively align with the chips 21 or thefingerprint identification elements 23 of the multiple electronicmodules 20, so each one of the chips 21 and each one of the fingerprintidentification elements 23 are exposed respectively through one of themultiple operation holes 42.

By means of the aforementioned technical features, a user may directlyuse the transitional layer for electronic modules A to embed programmedcodes into the multiple electronic modules 20 via the exposed chips 21and the exposed fingerprint identification elements 23, through themultiple operation holes 42 of the second release paper 40. Throughoutthe process, the adhesive coats 103, 104 and the release papers 30, 40provide the multiple electronic modules 20 with effects of packaging andprotecting. Therefore, the multiple electronic modules 20 may beprevented from being bended and thereby being damaged by thetransitional layer for electronic modules A, in comparison with theprior art.

Moreover, with reference to FIGS. 5 and 6, after being programmed, therelease papers 30, 40 may be removed, and the user may paste a firstprinted layer 50 and a second printed layer 60 on the two surfaces ofthe substrate 10 and the multiple electronic modules 20, respectively.In detail, the two printed layers 50, 60 are firstly covered on the twoadhesive coats 103, 104, respectively. Next, the adhesive coats 103, 104may be melted via a process of hot pressing, and thereby adhere the twoprinted layers 50, 60. After the adhesive coats 103, 104 resolidify, thetwo printed layers 50, 60 are attached to the transitional layer forelectronic modules A.

The second printed layer 60 has multiple holes 61 and multiple buttonmarks 62. The multiple holes 61 are disposed through the second printedlayer 60 at spaced intervals. Each one of the multiple holes 61 alignswith a respective one of the chips 21 or a respective one of thefingerprint identification elements 23 of the multiple electronicmodules 20, so the chips 21 and the fingerprint identification elements23 are exposed through the multiple holes 61. The multiple button marks62 are marked on a surface of the second printed layer 60 away from thesubstrate 10, and each one of the multiple button marks 62 aligns withand covers a respective one of the buttons 22 of the multiple electronicmodules 20. After cutting, with reference to FIG. 6, multiple integratedcircuit cards B may be obtained.

A producing method of the transitional layer for electronic modules isalso provided in the present invention. With reference to FIGS. 1 and 7,the producing method comprises the following steps.

A substrate preparing step: prepare a substrate 10 and a first releasepaper 30. Multiple containing holes 11 and multiple positioning parts 12are disposed through the substrate 10. Multiple first release paperpositioning parts 31 are disposed on the first release paper 30. Afterthe first release paper 30 is coated with viscose, the first releasepaper 30 may be pasted on the substrate 10, by overlapping the multiplefirst release paper positioning parts 31 and the multiple positioningparts 12 of the substrate 10.

An electronic modules mounting step: prepare multiple electronic modules20. With reference to FIG. 2, a chip 21, a button 22, and a fingerprintidentification element 23 are electrically connected and located on asame surface of each one of the multiple electronic modules 20. Themultiple electronic modules 20 are respectively put in the multiplecontaining holes 11 to be mounted to the substrate 10 and the firstrelease paper 30. Besides, the multiple electronic modules 20 areidentically oriented while being mounted to the substrate 10.

A second release paper mounting step: prepare a second release paper 40having multiple second release paper positioning parts 41 and multipleoperation holes 42. Coat a surface, which is away from the first releasepaper 30, of the substrate 10 along with the multiple electronic modules20 with viscose. Thereby the second release paper 40 may be neatlypasted on the substrate 10 by overlapping the second release paperpositioning parts 41 and the positioning parts 12 of the substrate 10.Furthermore, the multiple operation holes 42 communicate with the chips21 and the fingerprint identification elements 23 of the multipleelectronic modules 20.

A rolling and standing step: apply cold pressing on the two releasepapers 30, 40 with a roller module so as to squeeze the two releasepapers 30, 40, the substrate 10, and the multiple electronic modules 20for air exhausting. Then the two release papers 30, 40 closely abut onthe substrate 10. After a standing time, the viscose between thesubstrate 10, the electronic modules 20 and the two release papers 30,40 will solidify and respectively form a first adhesive coat 103 and asecond adhesive coat 104. The two adhesive coats 103, 104 closely coverthe multiple electronic modules 20 and provide effects of flat packagingand protecting. A finished product of the transitional layer forelectronic modules A is thereby produced, and moreover, the transitionallayer for electronic modules A has flat surfaces.

With the producing method of the transitional layer for electronicmodules, a producing method of integrated circuit cards is furtherprovided. With reference to FIG. 8, the producing method of integratedcircuit cards comprises all the steps of the producing method of thetransitional layer for electronic modules, and further comprises thefollowing steps.

A programmed code embedding step: the user may press the buttons 22 ofthe multiple electronic modules 20 through the second release paper 40,and embed programmed codes into the electronic modules 20 via the chips21 and the fingerprint identification elements 23 through the multipleoperation holes 42 of the second release paper 40.

A printed layers pasting and cutting step: with reference to FIGS. 3 and4, remove the two release papers 30, 40 of the transitional layer forelectronic modules A, and paste a first printed layer 50 and a secondprinted layer 60 in replacement. Besides, multiple holes 61 are disposedthrough the second printed layer 60, and align with the chips 21 and thefingerprint identification elements 23 of the multiple electronicmodules 20. Multiple button marks 62 are marked on the second printedlayer 60 and cover the buttons 22 of the multiple electronic modules 20.Through a process of hot pressing, the two printed layers 50, 60 and thetransitional layer for electronic modules A may be cut into multipleintegrated circuit cards B.

With aforementioned technical features, the multiple electronic modules20 are put in the containing holes 11 of the substrate 10, which isbeforehand mounted with the first release paper 30. After mounting thesecond release paper 40, the user may produce integrated circuit cardseasily with the transitional layer for electronic modules A, thereby notonly improving working efficiency, but also preventing the multipleelectronic modules 20 from being bended and damaged as well. Therefore,the producing method of the transitional layer for electronic modules inaccordance with the present invention effectively improves theshortcoming of the prior art.

Even though numerous characteristics and advantages of the presentinvention have been set forth in the foregoing description, togetherwith details of the structure and features of the invention, thedisclosure is illustrative only. Changes may be made in the details,especially in matters of shape, size, and arrangement of parts withinthe principles of the invention to the full extent indicated by thebroad general meaning of the terms in which the appended claims areexpressed.

1. A transitional layer for electronic modules, the transitional layercomprising: a substrate having multiple containing holes disposedtherethrough at spaced intervals; multiple electronic modulesrespectively mounted to the substrate, each one of the multipleelectronic modules located in a respective one of the multiplecontaining holes and having at least one input element; and two releasepapers respectively mounted to the substrate and the multiple electronicmodules via an adhesive coat, and at least one of the two release papershaving multiple operation holes disposed therethrough and aligning withthe input elements of the multiple electronic modules.
 2. Thetransitional layer for electronic modules as claimed in claim 1, whereineach one of the multiple electronic modules has multiple said inputelements, which comprise a chip, a button, and a fingerprintidentification element, and the multiple input elements are disposed ona same surface of the electronic module.
 3. The transitional layer forelectronic modules as claimed in claim 1, wherein: the multipleelectronic modules are identically oriented and mounted to thesubstrate; and one of the two release papers has said multiple operationholes disposed therethrough, and respectively aligning with the inputelements.
 4. The transitional layer for electronic modules as claimed inclaim 3, wherein: the substrate has multiple positioning parts disposedat spaced intervals; and each one of the two release papers has multiplerelease paper positioning parts aligning with the multiple positioningparts of the substrate.
 5. A producing method of a transitional layerfor electronic modules, and the producing method comprising: a substratepreparing step for preparing: a substrate having multiple containingholes disposed therethrough; and a first release paper coated withviscose to paste on the substrate; an electronic modules mounting stepcomprising: preparing multiple electronic modules, wherein each one ofthe multiple electronic modules has at least one input element; andputting each one of the multiple electronic modules in a respective oneof the multiple containing holes; and a second release paper mountingstep comprising: preparing a second release paper with multipleoperation holes; coating the substrate and the multiple electronicmodules with viscose; and pasting the second release paper on thesubstrate, wherein each one of the multiple operation holes communicateswith a respective one of the input elements of the multiple electronicmodules.
 6. The producing method of a transitional layer for electronicmodules as claimed in claim 5, wherein in the substrate preparing step,the substrate has multiple positioning parts disposed at spacedintervals; and the first release paper has multiple first release paperpositioning parts, and is pasted on the substrate by overlapping themultiple first release paper positioning parts and the multiplepositioning parts of the substrate.
 7. The producing method of atransitional layer for electronic modules as claimed in claim 5, whereinin the second release paper mounting step, the substrate has multiplepositioning parts disposed at spaced intervals; and the second releasepaper has multiple second release paper positioning parts, and is pastedon the substrate by overlapping the multiple second release paperpositioning parts and the multiple positioning parts of the substrate.8. The producing method of a transitional layer for electronic modulesas claimed in claim 5, wherein: each one of the multiple electronicmodules comprises multiple said input elements including: a chip; abutton; and a fingerprint identification element; the second releasepaper has multiple operation holes disposed therethrough; and in thesecond release paper mounting step, the second release paper is pastedon the substrate with each one of the multiple operation holescommunicating with a respective one of the chips or a respective one ofthe fingerprint identification elements of the multiple electronicmodules.
 9. The producing method of a transitional layer for electronicmodules as claimed in claim 5, wherein after the second release papermounting step, the producing method further comprises: a rolling andstanding step comprising squeezing the two release papers for exhaustingair between the substrate, the multiple electronic modules, and the tworelease papers, closely abutting the substrate and the two releasepapers, and packaging the multiple electronic modules.
 10. A producingmethod of integrated circuit cards, with the producing methodcomprising: a substrate preparing step for preparing: a substrate havingmultiple containing holes disposed therethrough; and a first releasepaper coated with viscose to paste on the substrate; an electronicmodules mounting step comprising: preparing multiple electronic modules,wherein each one of the multiple electronic modules has at least oneinput element; and putting each one of the multiple electronic modulesin a respective one of the multiple containing holes; a second releasepaper mounting step comprising: preparing a second release paper withmultiple operation holes; coating the substrate and the multipleelectronic modules with viscose; and pasting the second release paper onthe substrate, wherein each one of the multiple operation holescommunicates with a respective one of the input elements of the multipleelectronic modules; a rolling and standing step comprising squeezing thetwo release papers for exhausting air between the substrate, themultiple electronic modules, and the two release papers, closelyabutting the substrate and the two release papers, and packaging themultiple electronic modules; a programmed code embedding step; and aprinted layers pasting and cutting step comprising: removing the tworelease papers; pasting two printed layers; and cutting the two printedlayers, the substrate, and the multiple electronic modules into multipleintegrated circuit cards.
 11. The producing method of integrated circuitcards as claimed in claim 10, wherein in the substrate preparing step,the substrate has multiple positioning parts disposed at spacedintervals; and the first release paper has multiple first release paperpositioning parts, and is pasted on the substrate by overlapping themultiple first release paper positioning parts and the multiplepositioning parts of the substrate.
 12. The producing method ofintegrated circuit cards as claimed in claim 10, wherein in the secondrelease paper mounting step, the substrate has multiple positioningparts disposed at spaced intervals; and the second release paper hasmultiple second release paper positioning parts, and is pasted on thesubstrate by overlapping the multiple second release paper positioningparts and the multiple positioning parts of the substrate.
 13. Theproducing method of integrated circuit cards as claimed in claim 10,wherein: each one of the multiple electronic modules comprises multiplesaid input elements including: a chip; a button; and a fingerprintidentification element; the second release paper has multiple operationholes disposed therethrough; and in the second release paper mountingstep, the second release paper is pasted on the substrate with each oneof the multiple operation holes communicating with a respective one ofthe chips or a respective one of the fingerprint identification elementsof the multiple electronic modules.
 14. The transitional layer forelectronic modules as claimed in claim 2, wherein: the multipleelectronic modules are identically oriented and mounted to thesubstrate; and one of the two release papers has said multiple operationholes disposed therethrough, and respectively aligning with the inputelements.
 15. The transitional layer for electronic modules as claimedin claim 14, wherein: the substrate has multiple positioning partsdisposed at spaced intervals; and each one of the two release papers hasmultiple release paper positioning parts aligning with the multiplepositioning parts of the substrate.
 16. The producing method of atransitional layer for electronic modules as claimed in claim 6, whereinafter the second release paper mounting step, and wherein the producingmethod further comprises: a rolling and standing step comprisingsqueezing the two release papers for exhausting air between thesubstrate, the multiple electronic modules, and the two release papers,closely abutting the substrate and the two release papers, and packagingthe multiple electronic modules.
 17. The producing method of atransitional layer for electronic modules as claimed in claim 7, whereinafter the second release paper mounting step, and wherein the producingmethod further comprises: a rolling and standing step comprisingsqueezing the two release papers for exhausting air between thesubstrate, the multiple electronic modules, and the two release papers,closely abutting the substrate and the two release papers, and packagingthe multiple electronic modules.
 18. The producing method of atransitional layer for electronic modules as claimed in claim 8, whereinafter the second release paper mounting step, and wherein the producingmethod further comprises: a rolling and standing step comprisingsqueezing the two release papers for exhausting air between thesubstrate, the multiple electronic modules, and the two release papers,closely abutting the substrate and the two release papers, and packagingthe multiple electronic modules.